AI Cluster / Intra-DC
Low-latency, high-bandwidth optical fabric for GPU clusters and hyperscale data centres.
Training frontier AI models demands optical interconnects that deliver terabits of bandwidth at sub-microsecond latency, with deterministic performance across thousands of GPU nodes. SparkGrid's intra-DC solutions are purpose-built for this challenge.
The Challenge We Solve
The shift to 100,000+ GPU training clusters has fundamentally transformed data center networking. Traditional electrical interconnects fail to resolve the bandwidth-distance limitations between GPU racks, storage arrays and spine switches for large-scale AI workloads. Ultra-low-latency optical interconnect solution enables flat, non-blocking optical fabrics that eliminate electrical bottlenecks and scale linearly with cluster size.
GPU-to-GPU Bandwidth Explosion
H200/B200 NVLink domains require massive bisection bandwidth. Multi-rack GPU cluster scaling requires optical interconnects matching NVLink speeds.
Latency Sensitivity
All-reduce operations in distributed training are latency-critical. Every microsecond of added serialisation delay reduces GPU utilisation and extends training time.
Power Density
AI data centres already run at 50–100 kW per rack. Optical interconnect must deliver bandwidth-per-watt improvements over copper DAC/AOC to remain within power budgets.
Scale-Out Complexity
Managing thousands of optical links across a fat-tree or dragonfly topology requires automated link monitoring, BER tracking, and self-healing capabilities.
Key requirments
What SparkGrid Delivers
800G / 1.6T Design Service
Optimized DSP enables customized 800G/1.6T transmission for 100m–2km intra-DC AI fabric interconnections.
Sub-100ns Ultra-Low Latency
Accelerated FEC and optimized pipelines deliver sub-100ns optical latency, ideal for latency-sensitive AI all-reduce workloads.
Industry-Leading Low Power
Advanced process and core optimization enable ultra-low power operation, cutting data center rack load and OPEX.
In-Depth Integrated OAM
Per-lane BER monitoring, real-time OSNR estimation and full link telemetry enable proactive fault detection and fast isolation for large-scale AI clusters.
EE & OE Co-Designed Solution
Integrated EE/OE joint optimization delivers end-to-end chip-to-optical performance, with unified power control, signal tuning and rate adaptation for diverse intra-DC AI deployments.
Co-Packaged Solution
Optimized EE die supports 2.5D co-packaged integration, eliminating PCB trace loss and performance degradation.
Who Benefits
Explore Further
Ready to Get Started?
Talk to our engineering team about integrating SparkGrid solutions into your next-generation network.